May 28, 2025 -- EnSilica, a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), is pleased ...

Brite Semiconductor provides comprehensive silicon proven “YOU” IP portfolio and YouSiP (Silicon-Platform) solution. YouSiP solution provides a prototype design reference for system house and fabless ...

U.S. companies captured 54% of the total worldwide IC market in 2021, propelled by a 47% share of IDM sales and a 68% share of fabless sales. April 5, 2022 -- Regional marketshares of IDMs (companies ...

Chuangfeixin’s core team secured OTP-related patents as early as 2013, with deep expertise in anti-fuse OTP technology. The anti-fuse OTP IP employs oxide-layer breakdown programming and requires no ...

Siemens is making its AI-enhanced electronic systems design technology accessible to small and mid-sized businesses (SMB) with the release of PADS Pro Essentials software and Xpedition Standard ...

In an interview published in the Korean tech medium Chosun Biz, AMD’s Senior Vice President took a clear stance on the company’s future manufacturing strategy: From AMD’s perspective, TSMC is ...

In 2010, a modest summer project at UC Berkeley sought a suitable instruction set architecture (ISA). Now, 15 years later, RISC-V is a global alternative to commercial chip architectures.

With PADK, users access a secure, web-based interface that facilitates real-time collaboration without requiring deep ...

Notably, the IC market has never shown more than three sequential quarters of decline! November 11, 2022--The November Quarterly Update to the 2022 McClean Report will be released later this month.

Caesarea, Israel — October 11, 2022 — POLYN Technology, the innovative provider of unique NASP technology and a producer of Tiny AI chips and their associated IP, today announced the availability of ...

Expansion into Wi-Fi means Nordic’s ultra-low-power wireless IoT product range now covers Bluetooth, cellular IoT, and Wi-Fi Oslo, Norway – August 16, 2022 – Nordic Semiconductor today announces its ...

According to Etnews, Samsung is preparing for the future semiconductor market and plans to introduce glass substrates to improve packaging. This can be done by replacing Silicon interposers with Glass ...