There are lots of ways that we might build out the memory capacity and memory bandwidth of compute engines to drive AI and ...

Advanced packaging technologies, such as 2.5D and 3D integration, allow for the stacking of memory and logic chips. Stacking ...

As artificial intelligence (AI) applications expand, the demand for high-bandwidth memory (HBM) has surged. South Korean ...

High-Bandwidth Memory 5 is intended to further increase the number of memory layers. This requires modern stacking technology ...

The memory technology market has experienced significant fluctuations in recent years, marked by production cuts and shifting prices. The beginning of 2024 saw a gradual recovery, driven by rising ...

Samsung declared progress in supplying AI memory chips to Nvidia Corp., seeking to reassure to investors who fear the company ...

Nvidia is urging SK Hynix to fast-track the production of its high-bandwidth memory (HBM4) chips as demand for AI hardware ...

Nvidia Corp CEO Jensen Huang has requested SK Hynix Inc. to expedite the supply of its next-generation high-bandwidth memory chips by six months.

According to Bloomberg, Samsung’s AI memory delays have caused a $122B market value drop, with investors shifting focus to ...

A new ultraportable notebook from HP with the AMD Ryzen AI 300 "Strix Point" processor, set for release this December, ...

Samsung Electronics declared progress in supplying its most advanced artificial intelligence (AI) memory chips to Nvidia, ...