SiC and GaN advances used improved device structures and higher levels of integration to support higher voltages and power ...

According to market analyst Boston Consulting Group, the market for advanced microchip packaging is expected to grow to more than 96 billion dollars by 2030. For Trumpf and Schmid, advanced packaging ...

The active electronic component domain thrives on collaboration among semiconductor foundries, device manufacturers, and ...

Arizona has benefitted under the Biden Administration's oversight of the CHIPS Act, landing large federal grants, corporate ...