Insulated Wire Inc’s Log Spec PTFE insulated wire delivers high-performance, low-bulk data connectivity with enhanced ...
It delivers digital-layer BER and FEC performance validation for high-speed optical and copper interconnects used in network equipment and production network infrastructures. As interconnect speeds ...
Microchip Technology has announced its BZPACK mSiC power modules, designed to meet stringent High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standards. The modules can deliver ...
Toshiba Electronics Europe GmbH has added the DTMOSVI 600V HSD (High-Speed Diode) N-channel power MOSFETs to the DTMOSVI 600V Series, featuring a super junction structure. The seven new products are ...
SIMCom has announced two new smart modules that include AI and all the other functions necessary to simply and quickly add AI imaging functionality to a wide range of new applications. Comments Mads ...
MIKROE has launched Clicker 4 for R7FA4M2AD3CFP, a compact, low-cost development board designed as a complete, ready-to-go solution for building new products with unique functionalities. At its heart ...
Qualitas Semiconductor has selected the ShockLine MS46524B from Anritsu Corporation to enhance signal integrity verification for its high-speed interface IP development.
NeoCortec has announced the next-generation NeoGW software, a powerful multiplatform open-source solution designed to streamline integration between the NeoMesh network and upper-level systems, ...
ODU has joined the United Nations Global Compact (UNGC), the world’s largest sustainability and corporate responsibility initiative. The Global Compact unites over 26,000 companies and organisations ...
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