Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Vishay Intertechnology, Inc. introduced a new version of its free ThermaSim online thermal simulation tool for power MOSFETs, microBUCK® power ICs, and DrMOS products: ThermaSim 3.0. For precise ...

Joule heating, also known as resistive or Ohmic heating, is the power lost to heat as electrical current flows down a conductor. We were introduced to Joule’s first law (Power dissipation = I²R, VI, ...

The trend in end-equipment design is to optimize the module profile for sizing. This introduces a migration from metal heat sinks to PCB copper plane-based thermal management. Today’s modules use ...

It’s costly and time-consuming to determine the causes of hotspots on circuit boards, and to attempt to arrive at a “well-tempered” board through multiple iterations once a prototype is approved. A ...

The electronics industry exists in a continuous state of evolution. The world’s biggest companies are either launching new products, or refining and improving existing ones. In keeping with consumer ...

Accelsius, a two-phase liquid cooling company, is deploying one of its thermal rack simulation systems at a data center in Ohio. “We're excited to announce another deployment! This time, our Thermal ...