News

Samsung Electronics Co. is expanding its artificial intelligence ambitions for next year’s Galaxy S26 smartphones, entering ...
Samsung Electronics is reportedly pushing back the mass production of its next-gen high-bandwidth memory (HBM) chips to 2026, ...
Samsung unveils Galaxy Z Fold7 and Z Flip7, featuring upgrades in design, performance, and AI capabilities. Pre-booking offers include benefits worth ₹12,000.
South Korea’s top display makers Samsung Display and LG Display are cementing their dominance in the high-end OLED market by ...
Mobile gaming has become serious business, and smartphones are now expected to perform like full-fledged gaming rigs. For gamers who need a device as finely tuned as their reflexes, Samsung's Galaxy ...
Intel admits that it may halt or cancel development of its 14A (1.4nm-class) process node — its first to use High-NA EUV — if ...
The internals will diverge from past Samsung lineups. Instead of a matching Qualcomm processor like we have in the Z Fold 7, ...
TL;DR: Samsung Electronics is prioritizing advanced semiconductor packaging and robotics as key growth engines, focusing on next-gen glass interposers to enhance AI chip performance by 2028.
Samsung's Galaxy Ring 2 is already on the pipeline, but so are other smart jewelry wearables like necklaces, earrings, and ...
Samsung Is Launching Next-Gen Galaxy Z Foldables During July 9 Unpacked Event With AI-powered cameras and ultra-thin designs, you can't go wrong with Samsung Galaxy Z Fold 7 and Flip 7.
Utilizing new 1c DRAM technology, Samsung aims to supply high-performance memory for next-gen AI GPUs and accelerators, competing with SK hynix and Micron in the HBM4 market.
China’s giant BOE semiconductor and technology company is again suing South Korea-based Samsung over its use of BOE’s alleged OLED patents. The two business ...