Cadence unveils a spec-driven chiplet ecosystem with Arm and Samsung Foundry, aiming to cut integration risk and speed AI, ...

Cadence's new Chiplet Spec-to-Packaged Parts partner ecosystem reduces engineering complexity and accelerates time to market ...

We stand on the edge of a towering precipice, staring down at the wild, uncharted river where AI and high-performance computing converge. Below us, the current surges with breathtaking speed—rapids of ...

TAIPEI, Oct. 15, 2025 /PRNewswire/ -- VIA NEXT, a leading provider of system-level design services, today announced its participation in the Arm® Total Design ecosystem. This collaboration indicates ...

SAN DIEGO, CA, USA, February 28, 2023 /EINPresswire.com/ -- congatec – a leading vendor of embedded and edge computing technology – will be presenting its ...

EUGENE, OR., November 17, 2025— The E4S Project, today announced the immediate availability of E4S Release 25.11. E4S, an HPSF project, is the open-source, community-driven HPC-AI Software Ecosystem ...

HAMBURG, Germany--(BUSINESS WIRE)--xFusion Digital Technologies Co., Ltd. (xFusion) dazzled attendees with its top-of-the-range computing products and solutions at the prestigious ISC High Performance ...

– Powered by AMD CDNA™ 2 architecture and AMD ROCm™5, new AMD Instinct MI210 GPUs accelerating insights and discovery for mainstream users – “With twice the platforms available compared to our ...

Megawatts are still trading hands, and the AI trade is very much alive, according to investment banker Joe Nardini, as miners pivot to HPC and buyers chase scarce power.

This news release constitutes a "designated news release" for the purposes of the Company's amended and restated prospectus supplement dated May 14, 2025, to its short form base shelf prospectus dated ...