SAN JOSE, Calif.--(BUSINESS WIRE)--Daeduck Electronics announced the successful development of a large body FCBGA substrate for AI servers and data centers. Established in 1965, Daeduck Electronics ...

Samsung Electro-Mechanics will invest 4.27 trillion won to increase production capacity for semiconductor substrates used in ...

Mechanics, a member of Korean chaebol Samsung, plans to invest KRW2.51 trillion, or about $1.85 billion, to expand FCBGA ...

Samsung Electro-Mechanics Co. is planning on a record investment of up to 7 trillion won ($5.2 billion) to expand production ...

Dublin, Sept. (GLOBE NEWSWIRE) -- "Flip Chip Ball Grid Array Market in Canada" has been added to ResearchAndMarkets.com's offering. The global flip chip ball grid array (FCBGA) market is projected to ...

As the quantity, complexity, and functions of electronic devices in automobiles increase, understanding and characterizing package reliability is of significant concern and importance. The Automotive ...

DB Securities on the 1st said Samsung Electro-Mechanics (1,388,000 won ▲ 58,000 4.36%) is likely to see steep earnings growth on the back of price hikes and a boom in multilayer ...

An update on flip chip ball grid array (FCBGA) package development as quality and reliability requirements increase for larger and larger package form factors and approaches that should be taken to ...

FCBGA Sensor Interface Chips are designed to facilitate the connection between sensors and other electronic components. They serve as a bridge, converting sensor signals into a format that can be ...

Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from 5G applications in ...

High-capacity 802.11ax SoC for Routers, Gateways and Access Points. The IPQ8074 is Qualcomm ’s first 802.11ax network solution, designed to meet the growing demands of increasingly crowded and dense ...