Move over Kindle, there’s a new type of electronic book on the scene – and this one’s got pop-ups. The Electronic Popable book, developed by the High-Low Tech group at the MIT Media Lab in Cambridge, ...

Number of options for adding more features into chips grows beyond just 2.5D and 3D as mainstream packaging technologies run out of steam. Apple, Samsung and others are developing the next wave of ...

MOVE over Kindle, there’s a new type of electronic book on the scene – and this one’s got pop-ups. The Electronic Popable book, developed by the High-Low Tech group at the MIT Media Lab, has ...