SlimCell(TM) ECP System's Individual-Cell Chemistry Enables Industry's First Multi-Step Copper Plating Capability for 65nm and Beyond Copper Chips Applied Materials, Inc. introduces its 300mm SlimCell ...
Copper plating has been extensively employed in the fabrication of embedded packaging to reach high-density, high-speed, high performance electronic products. With through holes (TH) as well as blind ...
We would all like to 3D print in metal, but for now, the equipment to do that is out of reach for most of us. Instead of dealing with powder printers or metal-bearing polymers, [Robert] has a simple ...
Modern power systems rely on copper and aluminium components that operate reliably over many years, without sudden drops in conductivity or unexpected failures. It is the well-designed coating ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results