As semiconductor chip technology advances towards nanometre and sub-nanometre scales, the demands becomes exponentially more ...

Magnetic flux leakage (MFL) testing is a widely established non‐destructive evaluation technique used to assess the integrity of ferromagnetic materials in applications such as pipeline inspection and ...

Chipmakers are using more and different traditional tool types than ever to find killer defects in advanced chips, but they are also turning to complementary solutions like advanced forms of machine ...

As device sizes continue to increase on devices at 2x nm design rule and beyond and high wafer stress is worsening due to multi-film stacking in the vertical memory process, we observe an increasing ...

Modern advanced packaging processes and shrinking semiconductor device sizes mean that it is vital to consistently eliminate sub-20 nm defects and surface contaminants. To do this effectively, the ...

As design rules shrink to 45-nm and smaller, defect and yield engineers are becoming increasingly concerned about the quality of the defect frequency data coming from their review tools. To allow ...

What if manufacturing companies could pinpoint the exact cause of a defect the moment it occurs, preventing costly production delays and ensuring top-notch quality? Generative artificial intelligence ...

Failure analysis typically begins with identifying a region of interest (ROI) on a sample for detailed examination using tools such as a Scanning Electron Microscope (SEM), Focused Ion Beam (FIB), or ...