TweakTown

SK hynix developing 3D DRAM it calls 4F2 DRAM: joins South Korean competitor Samsung's 3D DRAM

SK hynix has just announced it's planning to develop a 4F2 (square) DRAM, joining South Korean rival Samsung and its journey into the world of 3D DRAM. The cost of EUV (extreme lithography) processes ...
Semiconductor Engineering

Baby Steps Toward 3D DRAM

Flash memory has made incredible capacity strides thanks to monolithic 3D processing enabled by the stacking of more than 200 layers, which is on its way to 1.000 layers in future generations.[1] But ...
TweakTown

Samsung teases 16-layer 3D DRAM with VCT DRAM as a 'stepping stone' for future RAM

VCT (vertical channel transistor) DRAM is one of the first achievements towards this goal, with Samsung expected to complete the initial development of VCT DRAM in 2025, with 3D DRAM hitting the ...
Digi Times

Samsung reportedly achieves technical breakthrough, stacking 3D DRAM to 16 layers

Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron. According to reports from TheElec and ZDNet Korea, citing industry sources, ...
WRIC

NEO Semiconductor Unveils Breakthrough 1T1C and 3T0C IGZO-Based 3D X-DRAM Technology

NEO's IGZO-based 3D X-DRAM delivers up to 512Gb density and 450-second retention with ultra-low power consumption — built on 3D NAND-compatible processes and optimized for AI, in-memory computing, and ...
Morningstar

Kioxia Develops Core Technology that Will Allow the Practical Implementation of High-density, Low-power 3D DRAM

Showcase the technology of highly stackable oxide-semiconductor channel transistors Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable ...
EDN

DRAM for energy- and area-efficient analog in-memory computing

Machine learning (ML), a subset of artificial intelligence (AI), has become integral to our lives. It allows us to learn and reason from data using techniques such as deep neural network algorithms.
Semiconductor Engineering

Virtual Exploration Of Novel Vertical DRAM Architectures

Process and device technologies have had to overcome numerous technical challenges as DRAM memory devices have transitioned between different cell architectures. When DRAM technology nodes went beyond ...
AFP

Kioxia Develops Core Technology that Will Allow the Practical Implementation of High-density, Low-power 3D DRAM

Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable oxide-semiconductor channel transistors that will enable the practical implementation of ...